Effect of duty cycle and frequency on the ion current density on substrate and ion/atom ratio in magnetron sputtering of aluminum
Vladimir Oskirko, A.N. ZAKHAROV, A.P. PAVLOV, V.A. SEMENOV, A.A. SOLOVYEV
High Current Electronics Institute of the Siberian Branch of the RAS, Tomsk, Russian Federation
AS
Alexey Serdobintsev
2020-09-25 16:55
Good day. Thank you for interesting poster/presentation concerning thorough investigation of pulsed modes of magnetron sputtering. Can you say some words about physical reasons of revealed dependences? Why the ion/atom ratio increased with a duty cycle decrease for example?
VO
Author
Vladimir Oskirko
2020-09-25 16:55
Alexey Serdobintsev 2020-09-23 13:00
Good day. Thank you for interesting poster/presentation concerning thorough investigation of pulsed modes of magnetron sputtering. Can you say some words about physical reasons of revealed dependences? Why the ion/atom ratio increased with a duty cycle decrease for example?
Hello. There are two main reasons. First, an increase in the pulsed discharge power leads to a decrease in the deposition rate (the effect is typical for HIPIMS, associated with the ionization of the sputtered material and its return to the target). Second, we observe an increase in the ion current density with increasing frequency. During the pause, the ionic current continues to flow onto the substrate, which leads to an increase in its average value. These two phenomena lead to an increase in the ratio of the number of ions to the number of atoms.
AS
Alexey Serdobintsev
2020-09-25 17:44
Thank you for your answer!
